General Chair: Mottaqiallah Taouil

Delft University of Technology (NL)

 

General Chair: Bram Kruseman

NXP (NL)

 

General Vice-Chair: Artur Jutman

Tallinn University (EE)

General Vice-Chair: Jaan Raik

Tallin University (EE)

 

Program Chair: Maria Michael

University of Cyprus (CY)

 

 

 

Program Vice-Chair: Matteo Sonza Reorda

Politecnico ti Torino (IT)

 

Program Vice-Chair: Arnaud Virazel (FR)

LIRMM (FR)

Industrial Liaison: Paolo Bernardi

Politecnico di Torino (IT)

 

Industrial Liaison: Stephan Eggersglüß

Siemens EDA (DE)

 

Industry Board: Davide Appello

Technoprobe (IT)

 

Industry Board: Souhir Mhira

STMicroelectronics (FR)

 

Publicity: Giorgio Di Natale

TIMA (FR)

 

Publicity: Alexandra Kourfali

ITI Stuttgart (LU)

Publication: Anteneh Gebregiorgis

Delft University of Technology (NL)

Publication: Tara Ghasempouri

Tallinn University (EE)

 

Regional Liaison: Ernesto Sanchez

Politecnico di Torino (IT)

 

Regional Liaison: Sule Ozev

Arizona State University (US)

 

Student Activities: Maksim Jenihhin

Tallinn University (EE)

 

Student Activities: Leticia B. Poehls

RWTH Aachen University (DE)

 

Fringe Workshop: Alessandro Savino

Politecnico di Torino (IT)

 

Fringe Workshop: Yanjing Li

University of Chicago (US)

 

Awards: Zebo Peng

Linkoping University (SE)

 

Awards: Sybille Hellebrand

Paderborn University (DE)

 

PhD Forum: Paolo Rech

Trento University (IT)

 

PhD Forum: Angeliki Kritikakou

Rennes University (FR)

 

McClusky Thesis Contest: Arnaud Virazel

LIRMM, FR

 

McClusky Thesis Contest: Teresa McLaurin (US)

ARM (US)

 

Embedded Tutorial: Stefano di Carlo

Politecnico di Torino (IT)

 

Embedded Tutorial Liviu Miclea

CLUJ-NAPOCA University (RO)

 

Special Session: Matteo Sonza Reorda

Politecnico ti Torino (IT)

 

Special Session: Gildas Leger

University of Seville (SP)

 

Panel: Alberto Bosio

LIRMM (FR)

 

Panel: Elena Ioana Vatajelu

TIMA Grenoble (FR)

 

Test Spring School: Elena Ioana Vatajelu

TIMA Grenoble (FR)

 

Test Spring School: Hussam Amrouch

Technical University of Munich (DE)